Grain structure of thin electrodeposited and rolled copper foils

Materials Characterization

Volumn 53, Issue 5, 2004, Pages 335-360

  Merchant, H D ^a   Liu, W C ^b   Giannuzzi, L A ^c   Morris, J G ^b  

^a Gould Electronics   (United States)

^b UNIVERSITY OF KENTUCKY   (United States)

^c UNIVERSITY OF CENTRAL FLORIDA   (United States)

Author keywords

Copper; Crystallographic texture; Deposit; Electrodeposition; Foil; Grain structure; Rolling; Sheet

Indexed keywords

ANISOTROPY; COPPER; CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; ELECTRODEPOSITION; ELECTROLYTES; RANDOM PROCESSES; ROLLING; TEXTURES; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

CELLULAR SUBSTRUCTURE; CRYSTALLOGRAPHIC TEXTURE; FREE SURFACES; SPECIMENS;

METAL FOIL;

EID: 10844250342     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2004.07.013     Document Type: Article

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