Water diffusion coefficients during copper electropolishing

Journal of Applied Electrochemistry

Volumn 34, Issue 12, 2004, Pages 1215-1219

  Du, Bing ^a   Suni, Ian Ivar ^b  

^a CLARKSON UNIVERSITY   (United States)

^b Clarkson University   (United States)

Author keywords

Chronoamperometry; Cottrell analysis; Diffusion coefficient; Electrodissolution; Electropolishing; Levich analysis; Planarization

Indexed keywords

COPPER; CYCLIC VOLTAMMETRY; DIFFUSION; DISSOLUTION; ELECTROCHEMICAL ELECTRODES; ELECTROLYTES; PHOSPHORIC ACID; VISCOSITY; WATER;

CHEMICAL MECHANICAL PLANARIZATION (CMP); CHRONOAMPEROMETRY; COTTRELL ANALYSIS; DIFFUSION COEFFICIENTS; ELECTRODISSOLUTION; LEVICH ANALYSIS;

ELECTROLYTIC POLISHING;

EID: 10844244617     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10800-004-3303-7     Document Type: Article

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