Comparison of via-fabrication techniques for through-wafer electrical interconnect applications

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1466-1470

  Polyakov, Alexander ^a   Grob, Timon ^b   Hovenkamp, Ron A ^b   Kettelarij, Henk J ^b   Eidner, Ines ^a   De Samber, Marc A ^b   Bartek, Marian ^a   Burghartz, Joachim N ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

BIPOLAR TRANSISTORS; ELECTRIC POWER TRANSMISSION; ELECTRONICS PACKAGING; FABRICATION; LASER ABLATION; PHOTOSENSITIVITY; REACTIVE ION ETCHING; SILICON WAFERS; STRENGTH OF MATERIALS;

ELECTRICAL INTERCONNECTS; LASER MELT CUTTING; POWDER BLASTING; VACUUM CLAMPING;

ELECTRIC POWER SYSTEM INTERCONNECTION;

EID: 10444289761     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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