Reliability investigations of hard core solder bumps using mechanical palladium bumps and SnPb solder

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 25, Issue 3, 2002, Pages 210-216

  Oppermann, Hermann ^a   Kalicki, Robert ^b   Anhoeck, Sabine ^c   Kallmayer, Christine ^c   Klein, Matthias ^c   Aschenbrenner, Rolf ^b   Reichl, Herbert ^b  

^a UNIVERSITY OF TOKYO   (Japan)

^b FRAUNHOFER IZM   (Germany)

^c TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

Flip chip; Intermetallic compound; Intermetallics; Mechanical stud bumping; Palladium; Reliability; Single chip bumping; Solder reaction; Under bump metallization

Indexed keywords

AGING OF MATERIALS; FLIP CHIP DEVICES; INTERMETALLICS; METALLIZING; PALLADIUM; RELIABILITY; SOLDERING ALLOYS; TIN ALLOYS;

HARD CORE SOLDER BUMPS; MECHANICAL PALLADIUM BUMPS; MECHANICAL STUD PUMPING; SINGLE CHIP BUMPING; SOLDER REACTION; UNDER BUMP METALLIZATION;

ELECTRONICS PACKAGING;

EID: 0036665773     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2002.806787     Document Type: Article

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