Grafting FIB "Lift-out" TEM sample for further ion milling and its application for semiconductor devices

Proceedings of the 30th International Symposium for Testing and Failure Analysis, ISTFA 2004

Volumn , Issue , 2004, Pages 324-330

  Wang, Nathan ^a   Wu, Jin ^a   Daniel, Sabbas ^a  

^a CYPRESS SEMICONDUCTOR   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; GRAFTING (CHEMICAL); IMAGE QUALITY; ION BEAMS; SEMICONDUCTOR DEVICES; TUNGSTEN;

FOCUSED ION BEAMS (FIB); LIFT OUT TECHNIQUES (LO); WEDGE-POLISHED (WP) SAMPLES;

TRANSMISSION ELECTRON MICROSCOPY;

EID: 10444271065     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. M.H.F. Overwijk et al, "Novel Scheme for the Preparation of Transmission Electron Microscopy Specimens with a Focused Ion Beam", J. Vacuum Science and Technology, B11 Vol. 6, (1993) p. 202.
2. st Inter. Symp. Test. Fail. Analysis, Nov.1995, p.353.
3. L.A. Giannuzzi and F.A. Stevie, "A Review of Focused Ion Beam Milling Techniques for TEM Specimen Preparation", Micron Vol. 30 (1999) pp. 197-204.
4. th Inter. Symp. Test. Fail. Analysis, Nov. 1998, pp.329-336.
5. B. Rossie, et al, "A Method for Thinning FIB Prepared TEM Specimens after Lift-out", Microscopy & Microanalysis, 2001, Vol. 7, No supp/2, pp.940.
6. th Inter. Symp. Test. Fail. Analysis Nov. 2002, Phoenix, Arizona, pp. 313-316.
7. D. A. Williams and C. B. Carter, Transmission Electron Microscopy, Plenum Press, (New York, 1996), p. 10.
8. N. Wang et al, "STEM Scanning Mode Observation of Semiconductor Devices", Proc. Microscopy and Microanalysis 2003, San Antonio, TX, August, 2003, p. 486CD.
9. D. A. Williams and C. B. Carter, Transmission Electron Microscopy, Plenum Press, (New York, 1996), p. 98.
10. N. Wang and S. Daniel, "microanalysis of Semiconductor Devices with FIB and TEM for Identifying Small Defects", EDFA Desk Reference Book Supplement, 2002, ASM international, Materials Park, 2003.
11. th Inter. Symp. Test. Fail. Analysis Nov. 2001, Santa Clara, pp. 313-317.