Corrosion of Intermetallic Layer and Reliability of Au/Al Bonds

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Volumn 63, Issue 3, 1999, Pages 406-415

  Uno, Tomohiro ^a   Tatsumi, Kohei ^a  

^a NIPPON STEEL CORPORATION   (Japan)

Author keywords

Aluminum oxide; Aluminum thin film; Bond strength; Bromine; Corrosion; Diffusion; Gold; Intermetallic formation; Molding resin; Reliability; Wire bonding

Indexed keywords

EID: 0011000106     PISSN: 00214876     EISSN: None     Source Type: Journal    
DOI: 10.2320/jinstmet1952.63.3_406     Document Type: Article

References (13)

1. T. Uno, K. Tatsumi and Y. Ohno: Proc. of the 1992 ASME/ JSME Joint Conference on Electronic Packaging, (1992), 771.
2. R. E. Thomas, V. Winchell, K. James and T. Scharr: Proc. of the 27th Electronic Components Conference, IEEE, (1977), 182.
3. A. A. Gallo: Proc. of IEEE Int. Reliability Physics Symp., (1990), 244.
4. K. N. Ritz, W. T. Stacey and R. K. Broadbent: Proc. of IEEE Int. Reliability Physics Symp., (1987), 28.
5. K. Tsubusaki, Y. Wakashima and N. Nagashima: Proc. of IEEE Int. Reliability Physics Symp., (1983), 83.
6. M. M. Khan and H. Fatami: Proc. of IEEE Int. Symp. Microelec., IEEE, (1986), 420.
7. S. Ahmad, R. Blish, T. Corbett, J. King and C. G. Shirley: IEEE Comp. Hybr. and Manuf. Technol, 9(1986), 127.
8. M. Hansen: Constitution of binary alloys, McGraw Hill, New York, (1958).
9. R. C. Blish, II and L. Parlbek: 21st Annual Proc. Rel. Phys. Symp., IEEE, (1983), 142.
10. M. Kashiwabara and S. Hattori: Review of the Electrical Communication Laboratory, 17(1961), 1001.
11. T. Uno and K. Tatsumi: to be published.