Micromechanical characterisation of Sn-Ag-Cu solder FCOB interconnects at ambient and elevated temperatures

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 128-133

  Li, Dezhi ^a   Liu, Changqing ^a   Conway, Paul ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; HARDNESS; INDENTATION; INTERMETALLICS; METALLIZING; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS;

MICROMECHANICAL CHARACTERIZATION; NANOINDENTATION; UNDER BUMP METALLIZATION (UBM);

OPTICAL INTERCONNECTS;

EID: 10444224605     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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