Process-property relationship of boron carbide thin films by magnetron sputtering

Thin Solid Films

Volumn 449, Issue 1-2, 2004, Pages 120-124

  Wu, Mei Ling ^a   Kiely, James D ^a   Klemmer, Timothy ^a   Hsia, Yiao Tee ^a   Howard, Kent ^a  

^a SEAGATE RESEARCH   (United States)

Author keywords

Boron carbide; Deposition process; Physical vapor deposition; Stress

Indexed keywords

ATOMIC FORCE MICROSCOPY; BORON CARBIDE; COMPRESSIVE STRESS; ION BOMBARDMENT; MAGNETRON SPUTTERING; PHYSICAL VAPOR DEPOSITION; RESIDUAL STRESSES; SPUTTER DEPOSITION; STOICHIOMETRY; SUBSTRATES; SURFACE ROUGHNESS; THICKNESS MEASUREMENT; X RAY PHOTOELECTRON SPECTROSCOPY;

DEPOSITION PROCESS; NANOSCRATCH TECHNIQUES; SCRATCH RESISTANCE;

THIN FILMS;

EID: 1042292768     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(03)01464-0     Document Type: Article

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