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Volumn 7, Issue 11, 2004, Pages
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Nanostructured TaN(O)/TaN barrier film formed by oxygen plasma treatment for copper interconnect
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Author keywords
[No Author keywords available]
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Indexed keywords
COPPER;
DIFFUSION;
GRAIN SIZE AND SHAPE;
MICROSTRUCTURE;
NANOSTRUCTURED MATERIALS;
OXYGEN;
PLASMAS;
TANTALUM COMPOUNDS;
TRANSMISSION ELECTRON MICROSCOPY;
X RAY DIFFRACTION ANALYSIS;
BARRIER LAYERS;
DIFFUSION BARRIERS;
MICROSTRUCTURAL MODIFICATION;
ULTRATHIN FILMS;
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EID: 10044220765
PISSN: 10990062
EISSN: None
Source Type: Journal
DOI: 10.1149/1.1805512 Document Type: Article |
Times cited : (6)
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References (10)
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