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Volumn 605, Issue , 2000, Pages 177-182
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Packaging MEM sensor arrays
a a a |
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Author keywords
[No Author keywords available]
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Indexed keywords
ARRAYS;
BOLOMETERS;
CERAMIC MATERIALS;
ELECTRONICS PACKAGING;
HYDROPHONES;
LOW TEMPERATURE OPERATIONS;
MICROELECTROMECHANICAL DEVICES;
MICROELECTRONIC PROCESSING;
SEMICONDUCTOR DEVICE MANUFACTURE;
SEMICONDUCTOR DEVICE MODELS;
SPURIOUS SIGNAL NOISE;
VACUUM APPLICATIONS;
MICROELECTROMECHANICAL SENSOR ARRAYS;
SENSOR CLUSTERS;
CHEMICAL SENSORS;
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EID: 0034498187
PISSN: 02729172
EISSN: None
Source Type: Journal
DOI: 10.1557/PROC-605-177 Document Type: Article |
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Times cited : (2)
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References (3)
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