A study on the variation of effective CTE of printed circuit boards through a validated comparison between strain gages and moiré interferometry

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 4, 2003, Pages 712-718

  Ratanawilai, Thanate B ^a   Hunter, Brian ^b   Subbarayan, Ganesh ^b   Rose, Dan ^c  

^a University of Colorado   (United States)

^b PURDUE UNIVERSITY   (United States)

^c Sun StorageTek   (United States)

Author keywords

Accuracy; CTE variation; Effective CTE; Moir interferometry; Strain gage technique; Thermal strain

Indexed keywords

ELECTRONICS PACKAGING; ERRORS; INTERFEROMETRY; MICROELECTRONICS; RELIABILITY; SOLDERED JOINTS; STRAIN GAGES; THERMAL EFFECTS; THERMAL EXPANSION;

COEFFICIENT OF THERMAL EXPANSION; MICROELECTRONIC PACKAGES; MOIRE INTERFEROMETRY; PLASTIC BALL GRID ARRAY PACKAGE ASSEMBLY; STRAIN GAUGE TECHNIQUE; THERMAL STRAIN;

PRINTED CIRCUIT BOARDS;

EID: 0742286699     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.821685     Document Type: Article

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