Aerodynamic and thermal investigation into axial flow fan cooling of electronic systems, Part I: Measurement techniques and steady flow measurements

Proceedings of the National Heat Transfer Conference

Volumn 1, Issue , 2001, Pages 123-130

  Grimes, R ^a   Davies, M ^a  

^a UNIVERSITY OF LIMERICK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

CODES (SYMBOLS); COOLING; ELECTRONICS PACKAGING; FANS; PRINTED CIRCUIT BOARDS; TEMPERATURE DISTRIBUTION; THERMOGRAPHY (IMAGING);

INFRARED CAMERAS; PARTICLE IMAGE VELOCIMETRY (PIV);

HEAT CONVECTION;

EID: 0348216498     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

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2. Davies, M.R.D., R. Cole, and J. Lohan, "Factors Affecting the Operational Thermal Resistance of Electronic Components," ASME Journal of Electronic Packaging, Vol. 122, Iss. 3, pp.185 - 191, September 2000
3. Cole, R., T. Dalton, J. Punch, M. Davies, and R. Grimes, "Forced Convection Board Level Thermal Design Methodology," accepted for publication, ASME Journal of Electronic Packaging
4. Rodgers, P., Lohan, J., Eveloy, V., Fager, C-M. and J. Rantala, "Validating Numerical Predictions of Component Thermal Interaction on Electronic Printed Circuit Boards in Forced Convection Airflows by Experimental Analysis" ASME EEP-Vol. 26-1, Advances in Electronic Packaging, Vol. 1, pp. 999-1009, May 1999
5. rd National Heat Transfer Conference, Paper 325, Albuquerque, USA, August 15-17, 1999
6. Grimes, R., Davies, M., Punch, J., Dalton, T., and Cole, R., 2001, "Modelling electronic cooling axial fan flows", accepted for publication, ASME Journal of Electronic Packaging, June, 2001.
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11. Punch, J. and Davies, M., 1997, "Still-air junction-to-ambient thermal resistance of different devices as functions of the effective thermal conductivity of printed circuit boards", EUROTHERM Seminar No. 58, Thermal Management of Electronic Systems III, pp. 262-268, Nantes, France, September 1997.
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