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Volumn 1, Issue , 2001, Pages 131-138

Aerodynamic and thermal investigation into axial flow fan cooling of electronic systems part II: Unsteady flow measurements

Author keywords

[No Author keywords available]

Indexed keywords

CODES (SYMBOLS); COOLING; ELECTRONICS PACKAGING; HEAT RESISTANCE; HEAT TRANSFER COEFFICIENTS; PRINTED CIRCUIT BOARDS; SWIRLING FLOW; VELOCITY MEASUREMENT;

EID: 0348216508     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (10)

References (8)
  • 1
    • 0348216508 scopus 로고    scopus 로고
    • Aerodynamic and Thermal Investigation Into Axial Flow Fan Cooling of Electronic Systems Part I: Measurement Techniques and Steady Flow Measurements
    • Paper NHTC01-14111, Anaheim, USA, June 10-12, 2001
    • th National Heat Transfer Conference, Anaheim, USA, June 10-12, 2001.
    • (2001) th National Heat Transfer Conference
    • Grimes, R.1    Davies, M.2
  • 2
    • 0020749546 scopus 로고
    • Enhanced and Local Heat Transfer, Pressure Drop, and Flow Visualization for Arrays of Block - Like Electronic Components
    • Sparrow, E. M., Vemur, S. B., and Kadle, D. S., 1983, "Enhanced and Local Heat Transfer, Pressure Drop, and Flow Visualization for Arrays of Block - Like Electronic Components," International Journal of Heat and Mass Transfer, Vol. 26, No. 5, pp. 689-699.
    • (1983) International Journal of Heat and Mass Transfer , vol.26 , Issue.5 , pp. 689-699
    • Sparrow, E.M.1    Vemur, S.B.2    Kadle, D.S.3
  • 4
    • 0026105933 scopus 로고
    • Direct Air Cooling of Electronic Components: Reducing Component Temperatures by Controlled Thermal Mixing
    • Anderson, A. M., and Moffat, R. J., 1991, "Direct Air Cooling of Electronic Components: Reducing Component Temperatures by Controlled Thermal Mixing," ASME Journal of Heat Transfer, Vol. 113, pp. 56-62.
    • (1991) ASME Journal of Heat Transfer , vol.113 , pp. 56-62
    • Anderson, A.M.1    Moffat, R.J.2
  • 6
    • 0003765769 scopus 로고
    • John Wiley and Sons Inc., New York
    • nd ed., John Wiley and Sons Inc., New York, 1995, pp. 269.
    • (1995) nd Ed. , pp. 269
    • Bejan, A.1
  • 8
    • 0025903080 scopus 로고
    • Numerical and Experimental Analysis of Fan-Induced Flow and Heat Transfer in Electronic Systems
    • ASME 1991
    • Lee, S. W., and Kim, S. J., 1991, "Numerical and Experimental Analysis of Fan-Induced Flow and Heat Transfer in Electronic Systems", HTD-Vol. 171, Heat Transfer in Electronic Equipment, ASME 1991.
    • (1991) Heat Transfer in Electronic Equipment , vol.HTD-171
    • Lee, S.W.1    Kim, S.J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.