A board level study of an array of ball grid components: Part I: Aerodynamic measurements

Proceedings of the National Heat Transfer Conference

Volumn 1, Issue , 2001, Pages 105-113

  Cole, Reena ^a   Davies, Mark ^a   Punch, Jeff ^a  

^a UNIVERSITY OF LIMERICK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

AERODYNAMICS; BOUNDARY LAYERS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; HEAT RESISTANCE; PRINTED CIRCUIT BOARDS; THERMAL CONDUCTIVITY OF SOLIDS; VELOCITY MEASUREMENT;

BALL GRID ARRAY (BGA); PARTICLE IMAGE VELOCIMETRY (PIV);

HEAT CONVECTION;

EID: 0012072932     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)

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18. th ed., 1992