Viscoplastic deformation of 60Sn-40Pb solder alloys (Description of strain rate effect)

Nippon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A

Volumn 63, Issue 609, 1997, Pages 954-961

  Ohguchi, Ken ichi ^a   Sasaki, Katsuhiko ^a   Ishikawa, Hiromasa ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CREEP; ELECTRONICS PACKAGING; MATHEMATICAL MODELS; STRAIN RATE; STRUCTURAL LOADS; TIN ALLOYS; VISCOPLASTICITY;

CYCLIC LOADING; NORTON'S CREEP;

SOLDERING ALLOYS;

EID: 0031146395     PISSN: 03875008     EISSN: None     Source Type: Journal    
DOI: 10.1299/kikaia.63.954     Document Type: Article

References (12)