Strain Rate Effect on Dynamic Nucleation at Triple Junctions in a Copper Tricrystal

Materials Transactions

Volumn 44, Issue 10, 2003, Pages 2213-2219

  Andiarwanto, Sutandyo ^a   Miura, Hiromi ^a   Sakai, Taku ^a  

^a UNIVERSITY OF ELECTRO COMMUNICATIONS   (Japan)

Author keywords

Copper; Dynamic recrystallization; Grain boundary sliding; Nucleation; Tricrystal; Triple junction

Indexed keywords

CRYSTALS; DEFORMATION; GRAIN BOUNDARIES; HIGH TEMPERATURE EFFECTS; NUCLEATION; OPTICAL MICROSCOPY; RECRYSTALLIZATION (METALLURGY); STRAIN RATE; STRESSES; TENSILE TESTING; THERMOMECHANICAL TREATMENT;

DYNAMIC RECRYSTALLIZATION (DRX); GRAIN-BOUNDARY SLIDING (GBS); ORIENTATION IMAGE MICROSCOPY (OIM); TRIPLE JUNCTIONS;

COPPER;

EID: 0347579163     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.44.2213     Document Type: Conference Paper

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