Strain-rate effect on dynamic recrystallization at grain boundary in Cu alloy bicrystal

Scripta Materialia

Volumn 48, Issue 10, 2003, Pages 1501-1505

  Miura, Hiromi ^a   Ozama, Masayoshi ^a   Mogawa, Ryo ^a   Sakai, Taku ^a  

^a UNIVERSITY OF ELECTRO COMMUNICATIONS   (Japan)

Author keywords

Bicrystal; Copper alloy; Dynamic recrystallization; Grain boundaries; High temperature

Indexed keywords

GRAIN BOUNDARIES; NUCLEATION; RECRYSTALLIZATION (METALLURGY); STRAIN RATE;

BICRYSTALS;

COPPER ALLOYS;

EID: 0037401322     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(03)00053-8     Document Type: Article

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