Preferential dynamic nucleation at triple junction in copper tricrystal during high-temperature deformation

Materials Transactions

Volumn 43, Issue 3, 2002, Pages 494-500

  Miura, Hiromi ^a   Andiarwanto, Sutandyo ^a   Sato, Keiichi ^a   Sakai, Taku ^a  

^a UNIVERSITY OF ELECTRO COMMUNICATIONS   (Japan)

Author keywords

Copper; Grain boundary sliding; High temperature; Microstructure; Recrystallization recovery; Triple junction

Indexed keywords

DEFORMATION; GRAIN BOUNDARIES; NUCLEATION; STRAIN; STRESS ANALYSIS;

COPPER TRICRYSTAL; DYNAMIC RECRYSTALLIZATION; HIGH TEMPERATURE DEFORMATION; TRIPLE JUNCTION;

COPPER;

EID: 0036506417     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.43.494     Document Type: Article

References (19)