Twin nucleation at triple junction during hot deformation of copper polycrystal

Materials Science Forum

Volumn 408-412, Issue I, 2002, Pages 755-760

  Miura, Hiromi ^a   Hamaji, Haruka ^a   Sakai, Taku ^a  

^a UNIVERSITY OF ELECTRO COMMUNICATIONS   (Japan)

Author keywords

Copper; Dynamic Recrystallization; Grain Boundary Sliding; Nucleation; SEM EBSP; Triple Junctions; Twin

Indexed keywords

COMPACTION; COPPER ALLOYS; CRYSTAL MICROSTRUCTURE; GRAIN BOUNDARIES; MICROSCOPIC EXAMINATION; NUCLEATION; PLASTIC DEFORMATION; RECRYSTALLIZATION (METALLURGY); SCANNING ELECTRON MICROSCOPY; STRAIN RATE; TWINNING;

TWIN NUCLEATION;

POLYCRYSTALS;

EID: 0036952301     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.408-412.755     Document Type: Conference Paper

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