Accuracy of structural approximations employed in analysis of area array packages

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1998, Pages 269-276

  Zhang, L ^a   Hunter, B ^a   Subbarayan, G ^a   Rose, D ^a  

^a UNIVERSITY OF COLORADO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; INTERFEROMETRY; MATHEMATICAL MODELS; SHEAR DEFORMATION; SOLDERED JOINTS; STIFFNESS;

AREA ARRAY PACKAGES; BALL GRID ARRAY; ELASTIC MATERIALS; MOIRE INTERFEROMETRY;

ELECTRONICS PACKAGING;

EID: 0031624415     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)