A board level study of an array of ball grid components: Part II: Thermal measurements

Proceedings of the National Heat Transfer Conference

Volumn 1, Issue , 2001, Pages 115-121

  Davies, Mark ^a   Cole, Reena ^a   Punch, Jeff ^a  

^a UNIVERSITY OF LIMERICK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

AERODYNAMICS; ANALOG TO DIGITAL CONVERSION; COMPUTER SIMULATION; COMPUTER SOFTWARE; DATA ACQUISITION; ELECTRONICS PACKAGING; GRAPHICAL USER INTERFACES; HEAT RESISTANCE; POLYNOMIALS; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR JUNCTIONS; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EFFECTS; THERMOGRAPHY (IMAGING); THERMOMETERS;

BALL GRID ARRAY (BGA); POWER DISSIPATION;

HEAT CONVECTION;

EID: 0346325799     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. Cole, R., Davies, M., and Punch, J., "A Board Level Study of an Array of Ball Grid Components - Part I: Aerodynamic Measurements," Proceedings of ASME National Heat Transfer Conference, June 2001
2. JEDEC International Standards, EIA/JESD51-3 "Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages," Electronic Industries Alliance, Eng. Dept.
3. SEMI International Standards, "G42-0996 Test Method - Thermal Test Board Standardisation for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages," Packaging Volume, pp. 195-200, 1996
4. Punch, J. and Davies, M.R.D., 'Still-air Junction-to-ambient Thermal Resistances of Different Devices as Functions of the Effective Conductivity of Printed Circuit boards,' EUROTHERM Seminar No. 58, Thermal Management of Electronic Systems HI, pp. 262-268, Nantes, France, September 1997
5. Teerstra, P., Culham, J.R., and Yovanovich, M., "An Investigation of the Relationship between Packaging Density and Effective Thermal Conductivity in Laminated Printed Circuit Boards," Proceedings of International Electronics Packaging Conference, pp. 158-170, 1995
6. Hamzehdoost, A., and Wong, F., "Impact of proximal Heat Sources on the Junction Temperature," Proceedings of International Electronics Packaging Conference, pp. 521-533, 1995
7. JEDEC International Standards, EIA/JESD51-7 "High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages," Electronic Industries Alliance, Eng. Dept., 1999
8. Lohan, J., Tillika, P., Rodgers, P., Fager, C-M., Rantala, J., "Effect of PCB Thermal Conductivity on the Operating Temperature of an SO-8 Package in a Natural Convection Environment: Experimental Measurement versus Numerical Prediction," Proceedings of the 5th THERMINIC workshop, Rome, 3-6 October, 1999, pg 207-213
9. Davies, M.R.D., R. Cole, and J. Lohan, "Factors Affecting the Operational Thermal Resistance of Electronic Components," ASME Journal of Electronic Packaging, Vol. 122, Iss. 3, pp. 185 - 191, September 2000
10. SEMI International Standards, "G42-0996 Test Method - Thermal Test Board Standardisation for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages," Packaging Volume, pp. 195-200, 1996
11. Lohan, J., "Investigation into the Thermal Interactions Between Electronic Components on a Printed Circuit Board," Ph.D. thesis, University of Limerick, Limerick, Ireland, 1995
12. Lohan, J., and Davies, M. R. D., "Thermal Interaction Between Electronic Components," ASME HTD-Vol. 329, Proceedings of the 32nd National Heat Transfer Conference, Vol. 7, pp. 73-82, 1996
13. Grimes, R., and Davies, M., "Aerodynamic and thermal investigation into axial flow fan cooling of electronic systems Part II: Unsteady flow measurements," Proceedings of ASME National Heat Transfer Conference, Paper No. NHTC01-14111, June 2001