Influence of reemission of neutrals on the shape of etched grooves

Vacuum

Volumn 72, Issue 4, 2004, Pages 481-484

  Knizikevicius R ^a  

^a KAUNAS UNIVERSITY OF TECHNOLOGY   (Lithuania)

Author keywords

Plasmochemical etching; Reemission; Silicon

Indexed keywords

ANISOTROPY; CARBON INORGANIC COMPOUNDS; COMPOSITION; COMPUTER SIMULATION; CONCENTRATION (PROCESS); EXTRAPOLATION; MASKS; OXIDATION; RATE CONSTANTS; THERMAL DIFFUSION;

PLASMA PROCESSING SYSTEMS; PLASMOCHEMICAL ETCHING; REEMISSION;

PLASMA ETCHING;

EID: 0346119939     PISSN: 0042207X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.vacuum.2003.10.011     Document Type: Article

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