Endpoint detectable plating through femtosecond laser drilled glass wafers for electrical interconnections

Sensors and Actuators, A: Physical

Volumn 108, Issue 1-3, 2003, Pages 234-238

  Abe, Takashi ^a   Li, Xinghua ^a   Esashi, Masayoshi ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Electrical interconnections; Endpoint detection; Femtosecond laser; Glass; Through hole plating

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COPPER; DEPOSITION; DRILLING; ELECTROPLATING; GLASS; LASER APPLICATIONS; MICROSTRUCTURE;

ELECTRICAL INTERCONNECTIONS; ENDPOINT DETECTION; FEMTOSECOND LASERS;

MICROSENSORS;

EID: 0344945412     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(03)00262-0     Document Type: Conference Paper

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