Coupling between microstrip lines embedded in polyimide layers for 3D-MMICs on Si

IEE Proceedings: Microwaves, Antennas and Propagation

Volumn 150, Issue 5, 2003, Pages 344-350

  Ponchak, G E ^a   Tentzeris, E M ^b   Papapolymerou, J ^b  

^a NASA GLENN RESEARCH CENTER   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTRIC FIELD EFFECTS; FINITE DIFFERENCE METHOD; MAGNETIC FIELD EFFECTS; MICROWAVE DEVICES; POLYAMIDES; SILICON WAFERS; TIME DOMAIN ANALYSIS;

ARRAY RADARS; THREE-DIMENSIONAL CIRCUITS;

MICROSTRIP LINES;

EID: 0344925778     PISSN: 13502417     EISSN: None     Source Type: Journal    
DOI: 10.1049/ip-map:20030545     Document Type: Conference Paper

References (13)

1. Ponchak, G.E.: 'RF transmission lines on silicon substrates'. 29th European Microwave Conference Digest, Munich, Germany, Oct. 5-7, 1999, pp. 158-161
2. Ponchak, G.E., Chun, D., Yook, J.-G., and Katehi, L.P.B.: "The use of metal filled via holes for improving isolation in LTCC RF and wireless multichip packages', IEEE Trans. Adv. Packag., 2000, 23, (1), pp. 88-99
3. Ponchak, G.E., Chun, D., Yook, J.-G., and Katehi, L.P.B.: 'Experimental verification of the use of metal filled via hole fences for crosstalk control of microstrip lines in LTCC packages', IEEE Trans. Adv. Packag., 2001, 24, (1), pp. 76-80
4. Onodera, K., Hirano, M., Tokumitsu, M., Toyoda, I., Nishikawa, K., and Tokumitsu, T.: 'Folded U-shaped microwave technology for ultra-compact three-dimensional MMICs', IEEE Trans. Microw. Theory Tech., 1996, 44, (12), pp. 2347-2353
5. Ponchak, G.E., Tentzeris, E.M., and Papapolymerou, J.: 'Coupling between microstrip lines embedded in polyimide layers for 3D-MMICs on Si'. IEEE MTT-S Int. Microwave Symposium Digest, Phoenix, AZ, May 20-25, 2001, pp. 1723-1726
6. Taflove, A.; 'Computational electrodynamics' (Artech House, Dedham, MA, 1995)
7. Roselli, L., Tentzeris, E., and Katehi, L.P.B.: 'Nonlinear circuit characterisation using a multiresolution time domain technique (MRTD)'. Proc. of the 1998 MTT-S Conference, Baltimore, MD, pp. 1387-1390
8. Leu, J., Ho, H.-M., Lee, J.K., Kasthurirangan, J., Liao, C.N., and Ho, P.S.: 'The evaluation of low dielectric constant materials for deep submicron interconnect applications'. Proc. 6th Meeting Dupont Symp. Polyimide Microelectronics, May 1-3, 1995
9. Dupont Company Pyralin LX data sheet
10. Marks, R.B.: 'A multilane method of network analyser calibration', IEEE Trans. Microw. Theory Tech., 1991, 39, pp. 1205-1215
11. Schelkunoff, S.A., and Odarenko, T.M.: 'Crosstalk between coaxial transmission lines', Bell Syst. Tech. J., 1937, 16, pp. 144-164
12. Kal, S., Bhattacharya, D., and Chakraborti, N.B.: 'Empirical relations for capacitive and inductive coupling coefficients of coupled microstrip lines', IEEE Trans. Microw. Theory Tech., 1981, 29, (4), pp. 386-388
13. Rainal, A.J.: 'Impedance and crosstalk of stripline and microstrip transmission lines', IEEE Trans. Compon. Packag., Manuf. Technol. B, Adv. Packag., 1997, 20, (3), pp. 217-224