Experimental verification of the use of metal filled via hole fences for crosstalk control of microstrip lines in LTCC packages

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 1, 2001, Pages 76-80

  Ponchak, George E ^a,b   Chun, Donghoon ^c   Yook, Jong Gwan ^a,d   Katehi, Linda P B ^a,c  

^a IEEE   (United States)

^b NASA GLENN RESEARCH CENTER   (United States)

^c UNIVERSITY OF MICHIGAN   (United States)

^d Gwangju Institute of Science and Technology (GIST)   (South Korea)

Author keywords

Coupling; Crosstalk; Microstrip; Microwave transmission lines

Indexed keywords

ELECTROMAGNETIC SIMULATION; LOW TEMPERATURE COFIRED CERAMIC; MICROWAVE TRANSMISSION LINE;

CERAMIC MATERIALS; COMPUTER SIMULATION; COPPER; FINITE ELEMENT METHOD; MICROSTRIP LINES; MOLYBDENUM; PERMITTIVITY; SUBSTRATES; THERMAL EXPANSION;

ELECTRONICS PACKAGING;

EID: 0035248257     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.909628     Document Type: Article

References (20)

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8. Isolation characteristics of via structures in high density stripline packages
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10. Filled via hole fences for crosstalk control of microstrip lines in LTCC packages
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12. Comparison of on-wafer calibrations
13. Power loss associated with conducting and superconducting rough interfaces
14. Filled via hole fences for crosstalk control of microstrip lines in LTCCpackages