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Volumn , Issue , 1997, Pages 326-330
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Beneficial effect of underfilling on the reliability of flip-chip joints
a
a
THOMSON multimedia
*
(Germany)
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESIVE JOINTS;
CONDUCTIVE PLASTICS;
COST EFFECTIVENESS;
ELECTRIC RESISTANCE;
FLIP CHIP DEVICES;
PLASTIC ADHESIVES;
PLASTICS FILLERS;
RELIABILITY;
SOLDERING;
SUBSTRATES;
THERMAL CYCLING;
THERMAL SHOCK;
UNDERFILLERS;
ELECTRONICS PACKAGING;
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EID: 0031387843
PISSN: 14029855
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (3)
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References (7)
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