Evaluating chemical mechanical cleaning technology for post-CMP applications

MICRO

Volumn 15, Issue 5, 1997, Pages 61-67

  De Larios, John M ^a   Zhang, Jackie ^a   Zhao, Eugene ^a   Gockel, Tom ^a   Ravkin, Michael ^a  

^a OnTrak Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0342754754     PISSN: 10810595     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (10)

1. DeJule R, "Advances in CMP," Semiconductor International, 19(12):88, 1996.
2. Jairath R, Pant A, Mallon T, et al., "Linear Planarization for CMP" Solid State Technology, 39(10): 1996.
3. De Larios JM, Ravkin MA, Hetherington DL, and Doyle JJ, "Post-CMP Cleaning for Oxide and Tungsten Applications," Semiconductor International, 19(5):121-128, 1996.
4. 2 Thin Films Studied by X-ray Reflectivity," Thin Solid Films, 280:37, 1996.
5. Kaufman FB, invited presentation at the Spring 1995 meeting of the Materials Research Society, San Francisco, CA.
6. Ravkin MA, Hetherington DL, de Larios JM, et al., "A New Chemical Mechanical Scrubbing Process Using HF for Post-CMP Cleaning Applications," in Proceedings of the First International CMP-MIC, Santa Clara, CA, February 1996.
7. Ali I, Roy SR, Shinn G, et al., "The Effect of Secondary Platen Downforce on Post-Chemical Mechanical Planarization Cleaning," in Proceedings of the Microcontamination Conference, Canon Communications, Santa Monica, CA, pp 196-205, 1994.
8. Ravkin MA, Hetherington DL, Zhang JX, et al., "Defect Evaluation for Primary Pad Oxide Polishing," in Proceedings of the Second International CMP-MIC, Santa Clara, CA, February 1997.
9. Krusell WC, de Larios JM, and Zhang J, "Mechanical Brush Scrubbing for Post-CMP Clean," Solid State Technology, 38(6):109-114, 1995.
10. Malik I, Emami R, Mallon T, et al., "CMP of FSG: Issues in Integration," in Proceedings of the Second International CMP-MIC, Santa Clara, CA, February 1997.