Monitoring in-situ density change for in-process measurement and control of hot-pressing

Forest Products Journal

Volumn 52, Issue 7-8, 2002, Pages 77-82

  Wang, Siqun ^a   Winistorfer, Paul M ^a  

^a UNIVERSITY OF TENNESSEE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MATERIALS; CURING; PROCESS CONTROL; STRUCTURAL PANELS; WOOD;

WOOD COMPOSITE MATERIALS;

HOT PRESSING;

COMPOSITES; CURING; HOT PRESSING; PANELS; PROCESS CONTROL; WOOD;

EID: 0036650607     PISSN: 00157473     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

1. Problems of pressing-time reduction in particleboard manufacture
2. Meeting OSB customer requirements
3. In-situ impedance sensors provide real-time monitoring and intelligent control for the curing of engineered wood products
4. Practical testing of urea resin glues for particleboard, with regard to shortening of pressing time
5. Fundamentals of vertical density profile formation in wood composites. Part 1. In-situ density measurement of the consolidation process