Monitoring bond strength development in particleboard during pressing, using acousto-ultrasonics

Wood and Fiber Science

Volumn 32, Issue 4, 2000, Pages 466-477

  Chen, Liheng ^a   Beall, Frank C ^b  

^a Albert Research Council Inc   (Canada)

^b FOREST PRODUCTS LABORATORY   (United States)

Author keywords

Acousto ultrasonics; Adhesive cure; Composite panels; Hot pressing; Internal bond; Nondestructive evaluation; On line sensing

Indexed keywords

EID: 0005874984     PISSN: 07356161     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (44)

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