Monitoring resin cure of medium density fiberboard using dielectric sensors

Materials Research Society Symposium - Proceedings

Volumn 430, Issue , 1996, Pages 601-605

  King, R J ^a   Rice, R W ^a  

^a KDC Technology Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MATERIALS; CURING; DENSITY (SPECIFIC GRAVITY); MOISTURE DETERMINATION; PERMITTIVITY MEASUREMENT; POLYMERS; PRESSURE EFFECTS; SENSORS; THERMAL EFFECTS; VISCOSITY;

ADHESIVE CURE; DIELECTRIC SENSORS; MEDIUM DENSITY FIBERBOARDS; MICROWAVE SENSORS; RESIN VISCOSITY;

MICROWAVE DEVICES;

EID: 0030384996     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-430-601     Document Type: Conference Paper

References (5)