Thermal shock fracture of piezoelectric materials

Philosophical Magazine

Volumn 83, Issue 5, 2003, Pages 631-657

  Wang, B L ^a,b   Mai, Yiu Wing ^a,c  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b HARBIN INSTITUTE OF TECHNOLOGY   (China)

^c UNIVERSITY OF SYDNEY   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY VALUE PROBLEMS; CRACKS; INTEGRAL EQUATIONS; STRESS ANALYSIS; TENSILE STRESS;

THERMAL SHOCK;

PIEZOELECTRIC MATERIALS;

EID: 0242380173     PISSN: 14786435     EISSN: None     Source Type: Journal    
DOI: 10.1080/0141861021000035053     Document Type: Article

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