SCOPUS 정보 검색 플랫폼

International Journal of Solids and Structures

Volumn 36, Issue 16, 1999, Pages 2463-2479

A closed crack tip model for interface cracks inthermopiezoelectric materials

(2) Qin, Qing Hua a Mai, Yiu Wing a

a UNIVERSITY OF SYDNEY (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACE CRACKS; THERMOPIEZOELECTRIC MATERIALS;

CRACK PROPAGATION; DISSIMILAR MATERIALS; INTEGRAL EQUATIONS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; PIEZOELECTRIC MATERIALS; STRESS INTENSITY FACTORS; THERMAL STRESS;

FRACTURE MECHANICS;

EID: 0033149443 PISSN: 00207683 EISSN: None Source Type: Journal
DOI: 10.1016/S0020-7683(98)00115-2 Document Type: Article

Times cited : (81)

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