General solutions for thermopiezoelectrics with various holes under thermal loading

International Journal of Solids and Structures

Volumn 37, Issue 39, 2000, Pages 5561-5578

  Qin, Qing Hua ^a  

^a UNIVERSITY OF SYDNEY   (Australia)

Author keywords

Crack; Integral equation; Piezoelectric; Thermomechanical voids

Indexed keywords

CONFORMAL MAPPING; CRACK INITIATION; ELECTRIC POTENTIAL; INTEGRAL EQUATIONS; PIEZOELECTRIC MATERIALS; PLATES (STRUCTURAL COMPONENTS); THERMAL LOAD; THERMAL STRESS;

STROH FORMALISM; TEMPERATURE DISCONTINUITY; THERMOELECTROELASTIC; THERMOMECHANICAL VOID; THERMOPIEZOELECTRICS;

STRUCTURAL ANALYSIS;

EID: 0033689032     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0020-7683(99)00225-5     Document Type: Article

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