Evolution of texture in electrodeposited Ni/Cu layered nanostructures

Philosophical Magazine

Volumn 83, Issue 4, 2003, Pages 457-476

  Ebrahimi, F ^a   Liscano, A J ^a   Kong, D ^a   Krishnamoorthy, V ^a  

^a J Crayton Pruitt Family Department of Biomedical Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRYSTALLOGRAPHY; ELECTRODEPOSITION; MICROSTRUCTURE; NICKEL; SCANNING ELECTRON MICROSCOPY; TEXTURES; THICK FILMS; TRANSMISSION ELECTRON MICROSCOPY; TWINNING; X RAY DIFFRACTION ANALYSIS;

ELECTROLYTE TEMPERATURE;

NANOSTRUCTURED MATERIALS;

EID: 0242334646     PISSN: 14786435     EISSN: None     Source Type: Journal    
DOI: 10.1080/0141861021000039455     Document Type: Article

References (21)

1. BRENNER, A., 1963, Electrodeposition of Alloys - Principles and Practice (New York: Academic Press), p. 139.
2. BONHÔTE, CH., and LANDOLT, D., 1997, Electrochim. Acta, 42, 2407.
3. CIZRÁKI, A., GERÖCS, I., FOGARASSY, B., ARNOLD, B., REIBOLD, M., WETZIG, K., TÓTH-KÁDÁR, E., and BAKONYI, I., 1997, Z. Metallk., 86, 781.
4. DE ANGELIS, R. J., KNORR, D. B., and MERCHANT, H. D., 1995, J. electron. Mater., 24, 927.
5. EBRAHIMI, F., BOURNE, G. R., KELLY, M. S., and MATTHEWS, T. E., 1999, Nanostruct. Mater. J., 11, 343.
6. EBRAHIMI, F., and LISCANO, A. J., 2001a, Mater. Sci. Engng, A301, 23; 2001b, Mater. Trans. Japan Inst. Metals, 42, 120.
7. EBRAHIMI, F., and LISCANO, A. J., 2001a, Mater. Sci. Engng, A301, 23; 2001b, Mater. Trans. Japan Inst. Metals, 42, 120.
8. EBRAHIMI, F., KONG, D., MATTHEWS, T. E., and ZHAI, Q., 1998, Processing and Fabrication of Advanced Materials VII, edited by T. S. Srivastan and K. A. Khor (Warrendale, Pennsylvania: Metallurgical Society of AIME), pp. 509-521.
9. EBRAHIMI, F., and AHMED, Z., 2002, Mater. Characterization Jl (in press).
10. LASHMORE, D. S., and DARIEL, M. P., 1988, J. electrochem. Soc., 135, 1218.
11. MENEZES, S., and ANDERSON, D. P., 1990, J. electrochem. Soc., 137, 440.
12. MERCHANT, H. D., 1995, Defect, Structure, Morphology and Properties of Deposits, edited by D. H. Merchant (Warrendale, Pennsylvania: Metallurgical Society of AIME), pp. 155.
13. RUFF, A. W., and LASHMORE, D. S., 1991, Wear, 151, 245.
14. SCHWARZACHER, W., and LASHMORE, D. S., 1996, IEEE Trans. Magnetism, 32, 3133.
15. SHOYKHET, B., GRINFELD, M. A., and HAZZELDINE, P. M., 1998, Acta mater., 46, 3761.
16. TENCH, D., and WHITE, J. T., 1984, Metall. Trans. A, 15, 2039; 1990, J. electrochem. Soc., 137, 3061; 1991, ibid., 138, 3757.
17. TENCH, D., and WHITE, J. T., 1984, Metall. Trans. A, 15, 2039; 1990, J. electrochem. Soc., 137, 3061; 1991, ibid., 138, 3757.
18. TENCH, D., and WHITE, J. T., 1984, Metall. Trans. A, 15, 2039; 1990, J. electrochem. Soc., 137, 3061; 1991, ibid., 138, 3757.
19. VAN HEERDEN, D., ZOIOTOYABKO, E., and SHECHTMAN, D., 1996, J. Mater. Res., 11, 2825.
20. WANG, L., FRICOTEAUX, P., YU-ZHANG, K., TROYON, M., BONHOMME, P., DOUGDALE, J., and METROT, A., 1995, Thin Solid Films, 261, 160.
21. YANG C.-C., and CHEH, H. Y., 1995, J. electrochem. Soc., 142, 3034.