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Volumn 301, Issue 1, 2001, Pages 23-34
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Microstructure/mechanical properties relationship in electrodeposited Ni/Cu nanolaminates
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Author keywords
Copper; Deformation; Fracture; Multilayers; Nickel; Texture
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Indexed keywords
COPPER;
DUCTILITY;
ELECTRODEPOSITION;
ELECTROLYTES;
EMBRITTLEMENT;
FRACTURE MECHANICS;
HYDROGEN;
NICKEL;
STRUCTURAL ANALYSIS;
TENSILE STRESS;
CLEAVAGE-LIKE FRACTURES;
SINGLE BATH SULFAMATE SOLUTIONS;
LAMINATES;
COPPER;
MECHANICAL PROPERTY;
MICROSTRUCTURE;
NICKEL;
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EID: 0035868724
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/S0921-5093(00)01384-8 Document Type: Article |
Times cited : (24)
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References (29)
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