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Volumn 42, Issue 1, 2001, Pages 120-127

Failure of Ni/Cu laminated nanostructures

Author keywords

Copper nickel; Electrodeposition; Fracture; Multilayered; Nanostructures; Strength

Indexed keywords

BRITTLENESS; COPPER; ELECTRODEPOSITION; FRACTURE; HYDRODYNAMICS; LAMINATED COMPOSITES; MULTILAYERS; NICKEL; TENSILE STRENGTH; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

EID: 0034986091     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.42.120     Document Type: Article
Times cited : (5)

References (27)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.