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Volumn 42, Issue 1, 2001, Pages 120-127
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Failure of Ni/Cu laminated nanostructures
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Author keywords
Copper nickel; Electrodeposition; Fracture; Multilayered; Nanostructures; Strength
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Indexed keywords
BRITTLENESS;
COPPER;
ELECTRODEPOSITION;
FRACTURE;
HYDRODYNAMICS;
LAMINATED COMPOSITES;
MULTILAYERS;
NICKEL;
TENSILE STRENGTH;
TRANSMISSION ELECTRON MICROSCOPY;
X RAY DIFFRACTION ANALYSIS;
MULTILAYERED STRUCTURES;
NANOSTRUCTURED MATERIALS;
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EID: 0034986091
PISSN: 13459678
EISSN: None
Source Type: Journal
DOI: 10.2320/matertrans.42.120 Document Type: Article |
Times cited : (5)
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References (27)
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