Coupling of large number of vias in electronic packaging structures and differential signaling

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 2002, Pages 983-986

  Chen, Houfei ^a   Li, Qin ^a   Tsang, Leung ^a   Jandhyala, Vikram ^a  

^a University of Washington   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER HARDWARE; COMPUTER SIMULATION; ELECTROMAGNETIC WAVE POLARIZATION; ELECTROMAGNETIC WAVE SCATTERING; GRADIENT METHODS; GREEN'S FUNCTION; MAGNETIC FIELDS; MATRIX ALGEBRA; METHOD OF MOMENTS; PERMITTIVITY; SPURIOUS SIGNAL NOISE;

BI-CONJUGATE GRADIENT METHOD; DENSELY PACKAGED INTEGRATED CIRCUIT; DIFFERENTIAL SIGNALING; FOLDY-LAX MULTIPLE SCATTERING FORMULA; MAGNETIC FIELD GREEN FUNCTION;

ELECTRONICS PACKAGING;

EID: 0036070280     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

1. Computation of inductance of simple vias between two striplines above a ground plane
2. Equivalent circuit models for three-dimensional multiconductor systems
3. Quasi-static analysis of a microstrip via through a hole in a ground plane
4. Rigorous and simplified models for the capacitance of a circularly symmetric via
5. Full wave characterization of a through hole via using the matrix-penciled moment method
6. Full-wave characterization of a through hole via in multi-layered packaging
7. Modeling and analysis of vias in multilayered integrated circuits
8. Coupled noise analysis for adjacent vias in multilayered digital circuits
9. The admittance of cylindrical antennas driven from a coaxial line
10. Modeling of interconnections and isolation within a multilayered ball grid array package
11. Modeling of multiple scattering among vias in planar waveguide using foldylax equations
12. Generalized pencil-of-function method for extracting poles of an EM system from its transient response