Aging effects on shear fatigue life and shear strength of soldered thick film joints

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 21, Issue 4, 1998, Pages 398-406

  Li, G Y ^b   Chan, Y C ^a,b  

^a IEEE

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Intermetallics; Reliability; Shear fatigue; Shear strength; SMT; Solder joints; Thick film conductor

Indexed keywords

AGING OF MATERIALS; BRITTLENESS; CONDUCTIVE FILMS; DEGRADATION; DIFFUSION IN SOLIDS; FATIGUE OF MATERIALS; INTERMETALLICS; METALLOGRAPHIC MICROSTRUCTURE; MICROANALYSIS; SHEAR STRENGTH; SOLDERED JOINTS; THICK FILMS;

MIXED BONDED CONDUCTORS;

ELECTRONICS PACKAGING;

EID: 0032202235     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.730424     Document Type: Article

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