-
4
-
-
0002969362
-
-
Japan Society of Applied Physics, Tokyo
-
Y. Homma, T. Furusawa, K. Kusukawa, S. Moriyama, H. Morishima, and H. Sato, in Proceedings Solid State Devices and Materials Conference (Japan Society of Applied Physics, Tokyo, 1995), p. 154.
-
(1995)
Proceedings Solid State Devices and Materials Conference
, pp. 154
-
-
Homma, Y.1
Furusawa, T.2
Kusukawa, K.3
Moriyama, S.4
Morishima, H.5
Sato, H.6
-
5
-
-
20444399401
-
-
Institute for Microelectronics Inter Connection, Tampa, FL
-
J. C. Maisonobe, G. Passemard, C. L. Lacour, Ch. Lecornec, P. Motte, P. Noel, and J. Torres, in Proceedings of the International Dielectrics for VLSI/ULSI Multilevel Interconnection Conference (DUMIC) (Institute for Microelectronics Inter Connection, Tampa, FL, 1999), p. 60.
-
(1999)
Proceedings of the International Dielectrics for VLSI/ULSI Multilevel Interconnection Conference (DUMIC)
, pp. 60
-
-
Maisonobe, J.C.1
Passemard, G.2
Lacour, C.L.3
Lecornec, Ch.4
Motte, P.5
Noel, P.6
Torres, J.7
-
6
-
-
0032301796
-
-
K. Endo, K. Shinoda, T. Tatsumi, Y. Matsubara, M. Iguchi, and T. Horiuch, Mater. Res. Soc. Symp. Proc. 511, 365 (1998).
-
(1998)
Mater. Res. Soc. Symp. Proc.
, vol.511
, pp. 365
-
-
Endo, K.1
Shinoda, K.2
Tatsumi, T.3
Matsubara, Y.4
Iguchi, M.5
Horiuch, T.6
-
7
-
-
0032305632
-
-
T. Ramos, K. Rhoderick, R. Roth, L. Brungardt, S. Wallace, J. Drage, J. Dunne, D. Endisch, R. Katsanes, N. Viernes, and D. M. Smith, Mater. Res. Soc. Symp. Proc. 511, 105 (1998).
-
(1998)
Mater. Res. Soc. Symp. Proc.
, vol.511
, pp. 105
-
-
Ramos, T.1
Rhoderick, K.2
Roth, R.3
Brungardt, L.4
Wallace, S.5
Drage, J.6
Dunne, J.7
Endisch, D.8
Katsanes, R.9
Viernes, N.10
Smith, D.M.11
-
8
-
-
0142056346
-
-
Institute for Microelectronics Inter Connection, Tampa, FL
-
A. Nakashima, R. Muraguchi, K. Komatsu, Y. Ohkura, M. Miyajima, H. Harada, and S. Fukuyama, in Proceedings of the International Dielectrics for VLSI/ULSI Multilevel Interconnection Conference (DUMIC) (Institute for Microelectronics Inter Connection, Tampa, FL, 1998), p. 25.
-
(1998)
Proceedings of the International Dielectrics for VLSI/ULSI Multilevel Interconnection Conference (DUMIC)
, pp. 25
-
-
Nakashima, A.1
Muraguchi, R.2
Komatsu, K.3
Ohkura, Y.4
Miyajima, M.5
Harada, H.6
Fukuyama, S.7
-
9
-
-
0029341466
-
-
M. Yoshikawa, Y. Mori, H. Obata, M. Maegawa, G. Katagiri, H. Ishida, and A. Ishitani, Appl. Phys. Lett. 67, 694 (1995).
-
(1995)
Appl. Phys. Lett.
, vol.67
, pp. 694
-
-
Yoshikawa, M.1
Mori, Y.2
Obata, H.3
Maegawa, M.4
Katagiri, G.5
Ishida, H.6
Ishitani, A.7
-
10
-
-
0030217659
-
-
M. Makita, K. Nishimura, T. Yara, N. Jang, A. Hatta, T. Ito, and A. Hiraki, Thin Solid Films 281, 279 (1996).
-
(1996)
Thin Solid Films
, vol.281
, pp. 279
-
-
Makita, M.1
Nishimura, K.2
Yara, T.3
Jang, N.4
Hatta, A.5
Ito, T.6
Hiraki, A.7
|