Surface damages on FIB prepared TEM-specimens: Possibilities of avoidance and removal

Microscopy and Microanalysis

Volumn 9, Issue SUPPL. 3, 2003, Pages 140-141

  Arnold, Birgit ^a   Lohse, Dina ^a   Bauer, Hans Dietrich ^a   Gemming, Thomas ^a   Wetzig, Klaus ^a   Binder, Klaus ^b  

^a IFW DRESDEN   (Germany)

^b Binder Labortechnik   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0142060632     PISSN: 14319276     EISSN: None     Source Type: Journal    
DOI: 10.1017/s1431927603016027     Document Type: Conference Paper

References (8)

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4. J. F. Ziegler, J. P. Biersack, U. Littmark, The stopping and range of ions in solids, Pergamon Press, New York, USA, 1985.
5. B. Arnold, H.-D. Bauer, Prakt. Metallogr. 40[3] (2003) 109.
6. L. Hillman, Infineon Technologies, personal communication, 2002.
7. South Bay Technology Inc.: Plasma Trimming for TEM Semiconductor Devices, company printed matter, 2001.
8. H.-D. Bauer, B. Arnold, K. Binder, Proc. of ICEM 03, Durban, S. A. (2002) 269.