Cartesian coordinate maps for chemical mechanical planarization uniformity characterization

Thin Solid Films

Volumn 308-309, Issue 1-4, 1997, Pages 512-517

  Bibby, Thomas F A ^a   Harwood, Randy ^a   Schey, Dennis ^a   McKinley, Kevin ^b  

^a IPEC Planar   (United States)

^b IPEC Precision   (United States)

Author keywords

Cartesian coordinate maps; Chemical mechanical planarization; Polar maps

Indexed keywords

SEMICONDUCTING FILMS; THICKNESS MEASUREMENT;

CARTESIAN COORDINATE MAPS; CHEMICAL MECHANICAL PLANARIZATION (CMP); POLAR MAPS;

CHEMICAL POLISHING;

EID: 0031251199     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(97)00435-5     Document Type: Article

References (7)

1. T. McHugh and P. Mumola, 'Visualizing film thickness via whole-wafer imaging', Solid State Technol., (1996) S11.
2. O'Mara, Planarization by Chemical-Mechanical Polishing for Multilevel Metal Integrated Circuits, O'Mara and Associates, Palo Alto, CA, 1994.
3. K. Holland and T. Bibby, Planarization by CMP for ULSI Applications, Taiwan IC Tech. Conf., add., 1995, p. 11.
4. K. Holland, T. Bibby, L. Williams, R. Cruz, J. Lee, B. Kraus, P. Parikh and D. Levedakis, Chemical mechanical polishing of high density plasma deposited oxides for planarized interlevel dielectric, Sernicon-Japan, 1995.
5. G. Dishon and M. Finarov, Monitoring Choices of CMP Planarization Processes, Proc. Second Ann. Chem.-Mechan. Pol. (CMP) for ULSI Multilevel Interconnect. Conf., 1997, 391.
6. M. Fury, The Establishment of Standards for the CMP Industry, Chem. Mechan. Pol. Workshop, Clarkson, NY, 1996.
7. Author please supply details for this reference.