Percolation theory applied to study the effect of shape and size of the filler particles in thermal interface materials

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 2000-V, Issue , 2000, Pages 365-371

  Devpura, Amit ^a   Phelan, Patrick E ^a   Prasher, Ravi S ^b  

^a AZ 85281   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; FILLERS; FLIP CHIP DEVICES; INTERFACES (MATERIALS); SOLVENTS; THERMAL CONDUCTIVITY;

CONDUCTING PARTICLES; DIFFERENT SHAPES; ELECTRONIC PACKAGING; FILLER PARTICLES; FLIP CHIP TECHNOLOGIES; PERCOLATION THEORY; PHYSICAL PHENOMENA; RATE OF HEAT TRANSFER; SHAPE AND SIZE; THERMAL INTERFACE MATERIALS;

HEAT TRANSFER;

EID: 84885261402     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2000-1541     Document Type: Conference Paper

References (13)

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