Improved reliability prediction through reduced-stress temperature cycling

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2000, Pages 231-236

  Cory, Alan R ^a  

^a AGERE SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; ENCAPSULATION; FAILURE ANALYSIS; MATHEMATICAL MODELS; RELIABILITY; STRESS ANALYSIS; THERMAL CYCLING; THERMAL STRESS;

REDUCED STRESS TEMPERATURE CYCLING; RELIABILITY STRESSES;

INTEGRATED CIRCUIT TESTING;

EID: 0033733539     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (4)