An Acoustic Sensor for Monitoring Microelectronics Packaging Manufacturing Processes

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2003, Pages 23-29

  Williams, Frances ^a   Pinkett, Shawn ^a   Hunt, William ^a   May, Gary S ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTICS; DEFORMATION; MICROELECTRONICS; PIEZOELECTRICITY; ZINC OXIDE; ACOUSTIC DEVICES; ACOUSTIC EQUIPMENT; FABRICATION; INDUSTRIAL ELECTRONICS; MONITORING; PACKAGING; SILICON; ZINC;

MICROELECTRONICS PACKAGING;

ELECTRONICS PACKAGING; MANUFACTURE;

ACOUSTIC SENSORS; MANUFACTURING PROCESS; MECHANICAL DEFORMATION; MECHANICAL SENSORS; MICROELECTRONICS FABRICATION; MICROELECTRONICS PACKAGING; MICROMACHINING TECHNIQUES; PLASMA MEASUREMENT;

EID: 0141676835     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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