Accuracy limitations in specular-mode optical topography extraction

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5038 I, Issue , 2003, Pages 547-558

  Terry Jr , Fred Lewis ^a  

^a University of Michigan   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELLIPSOMETRY; INTEGRATED CIRCUITS; REFLECTOMETERS; REFRACTIVE INDEX; SEMICONDUCTOR DEVICE STRUCTURES; THIN FILMS;

INTEGRATED CIRCUIT STRUCTURES; OPTICAL CRITICAL DIMENSION METROLOGY; SCATTEROMETRY; SPECULAR MODE SPECTROSCOPIC ELLIPSOMETRY;

DIFFRACTION GRATINGS;

EID: 0141500244     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.488484     Document Type: Conference Paper

References (10)

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2. "Specular spectroscopic scatterometry," Niu Xinhui, N Jakatdar, Junwei-Bao, C.J. Spanos, IEEE-Transactions-on-Semiconductor-Manufacturing. vol.14, no. 2; May 2001; p.97-111.
3. "Spectroscopic optical metrology for process characterization and control," J.Allgair and P. Herrera, Microlithography-World. vol. 11, no.11, Feb. 2002; p. 12, 14, 16, 23-4
4. "Fundamental solutions for real-time optical CD metrology," J. Opsal, H. Chu, Y. Wen, G. Li; Therma-Wave, Inc., SPIE Conference on Metrology, Inspection, and Process Control for Microlithography XVI, Santa Clara, CA, March, 4-7, 2002.
5. "Two-channel spectroscopic reflectometry for in situ monitoring of blanket and patterned structures during reactive ion etching," B. S. Stutzman, H.-T. Huang, and F. L. Terry, Jr., J. Vac. Sci. Techn., B18, pp. 2785-93 (2000).
6. "Normal Incidence Spectroscopic Ellipsometry for Critical Dimension Monitoring," Hsu-Ting Huang, Wei Kong, and Fred Lewis Terry, Jr., Applied Physics Letters, vol. 78, no. 25; 18 June 2001; p.3983-5
7. "Spectral scatterometry for 2D trench metrology of low-k dual-damascene interconnect," V. A. Ukraintsev, M. Kulkarni, C. Baum, K. Kirmse, Texas Instruments Inc.; M. Guevremont, S. Lakkapragada, K. N. Bhatia, P. P. Herrera, U. K. Whitney, KLA-Tencor Corp., SPIE Conference on Metrology, Inspection, and Process Control for Microlithography XVI, Santa Clara, CA, March 4-7, 2002.
8. "Real Time In Situ Monitoring of Deep Sub-μm Topography Evolution during Reaction Ion Etching," Hsu-Ting Huang, Ji-Woong Lee, Brooke S. Stutzman, Pete Klimecky, Craig Garvin, Pramod P. Khargonekar, and Fred L. Terry, Jr., SEMATECH AEC/APC Symposium, Lake Tahoe, NV., September 25-28, 2000.
9. "In Situ Monitoring Of Deep Sub-□m Topography Evolution And Endpoint Detection During Reactive Ion Etching," Hsu-Ting Huang, Ji-Woong Lee, Pete Klimecky, Pramod P. Khargonekar, and Fred L. Terry, Jr., SEMATECH AEC/APC Symposium XIII, October 6-11, 2001, Banff, Alberta, Canada
10. "Stable implementation of the rigorous coupled-wave analysis for surface-relief gratings: enhanced transmittance matrix approach," M.G. Moharam, D.A. Pommet, E.B. Grann, T.K. Gaylord, Journal-of-the-Optical-Society-of-America-A-(Optics,-Image-Science-and-Vision). vol.12, no.5; May 1995; p. 1077-86.