Measurement of Material Properties on Micro Components;Messung von Materialkennwerten an Komponenten der Mikrotechnik

Technisches Messen

Volumn 68, Issue 2, 2001, Pages 86-93

  Vogel, Dietmar ^a   Sommer, Johann Peter ^a   Großer, Volker ^a   Michel, Bernd ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BULK MATERIALS; DEFORMATION BEHAVIOR; FINITE ELEMENT SIMULATIONS; HYBRID APPROACH; MICRO-COMPONENTS; SPUTTERED LAYERS;

HYBRID MATERIALS;

MICROOPTICS;

EID: 0042972615     PISSN: 01718096     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (13)

1. Materials handbook for hybrid microelectronics, ed. by Joseph Alison, 1988, Artech House, Inc., Norwood, USA.
2. G. Elsner: Residual stress and thermal expansion of spun-on polyimide films, Journ. of Appl. Polymer Sciences, Vol. 34, 1987, pp. 815-828.
3. H. Ogawa et al.: Stress-strain diagrams of microfabricated thin films, Proc. of "Micro Materials '97", April 16-18, Berlin, pp. 716-719.
4. R. Willecke, P. S. Ho: Study of vertical thermo-mechanical properties of polyimide thin films, Proc. of "Micro Materials '97", April 16-18, Berlin, pp. 721-724.
5. D. Vogel, J. Auersperg, A. Schubert, B. Michel, H. Reichl: Deformation analysis on flip chip solder interconnects by microDAC, Proc. of Reliability of Solders and Solder Joints Symposium at 126th TMS Annual Meeting & Exhibition, Feb. 9-13, 1997, Orlando, USA, in "Reliability of Solders and Solder Interconnects", ed. by R. K. Mahidhara, TMS Publication Cat. No. 96-80433, pp. 429-438.
6. D. Vogel. A. Gollhardt, R. Kühnert, J. Auersperg, B. Michel: Microscopic Deformation Field Measurement Supporting FEA Based Reliability Analysis in Electronic Packaging, Proc. of the 1999 Workshop on Polymeric Materials for Microelectronics and Photonics Applications: Mechanics, Physics, Reliability, Processing, Paris, 1999, Dec. 12-15, EEP-Vol. 27, pp. 159-166.
7. D. Vogel, F. Luczak, O. Wittler, A. Gollhardt, H. Walter, B. Michel: Measurement of Material Properties by a Modified microDAC Approach, Proc. of Micro Materials 2000, Berlin, 2000.
8. A. Dehoff, M. Reetz, K. Wandel, R. Wolf: Plasmaprozess-Technologie für mikromechanische Messobjekte. tm - Technisches Messen 68 (2001) 57-60.
9. E. Suhir: Stress in bimaterial thermostates, J. Appl. Mech. 53, 1986, 657-660.
10. U. Breitmeier: Dimensional measurement of micro mechanical components, Proc. of "Micro System Technologies '94", Berlin, 1994, pp. 107-113.
11. W. Osten, S. Seebacher, Th. Baumbach, W. Jüptner: Messtechnische Grundlagen zur Inspektion von Mikrokomponenten auf Basis der digitalen Holografie. tm - Technisches Messen 68 (2001) 68-79.
12. M. Dost, J. Vogel, R. Döring: Einrichtung für die thermische Belastung zur lokalen Materialkennwertermittlung an Mikrokomponenten. tm - Technisches Messen 68 (2001) 61-67.
13. D. Vogel, A. Gollhardt, H. Walter, K.-F. Becker, R. Kühnert, B. Michel: Determination of CTE Values for Packaging Polymers - A Critical View to Accustomed Approaches, submitted to POLY 2000, London, Dec. 3-6, 2000.