A Thermal Loading Device for Local Parameter Determination at Microcomponents;Einrichtung für die thermische Belastung zur lokalen Materialkennwertermittlung an Mikrokomponenten

Technisches Messen

Volumn 68, Issue 2, 2001, Pages 61-67

  Dost, Michael ^a   Vogel, Jürgen ^a   Döring, Ralf ^a  

^a Chemnitzer Werkstoffmechanik GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DIGITAL HOLOGRAPHY; GRAY SCALE CORRELATIONS; MEASUREMENT METHODS; OPTICAL DISCONTINUITY; OPTICAL MEASURING METHODS; SMALL DEFORMATIONS; THERMAL AND MECHANICAL STABILITIES; THERMO-MECHANICAL LOADING;

COMPUTER GENERATED HOLOGRAPHY;

OPTICAL CORRELATION;

EID: 0041970953     PISSN: 01718096     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (2)

1. Dost, M. et al.: Correlation Analysis at Grey Scale Patterns in an in-situ Measuring Module for Microsystem Technology. In: Materials Mechanics - Fracture Mechanics - Micromechanics (Eds.: T. Winkler, A. Schubert), Berlin 1999, S. 259-266.
2. Vogel, J., Dost, M., Seebacher, S., Osten, W., Fassler, R., Köpp, N., Döring, R., Sommer, J.-P., Michel, B.: Modular Loading and Measuring System for Material Characterization of Microcomponents. Third Internat. Conference MicroMat2000, Berlin, April 17-19, 2000, Proc.