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Volumn 43, Issue 9-11, 2003, Pages 1871-1876

High temperature reliability on automotive power modules verified by power cycling tests up to 150°C

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC INVERTERS; INTERNAL COMBUSTION ENGINES; MOSFET DEVICES; WATER COOLING SYSTEMS;

EID: 0042694303     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00318-4     Document Type: Conference Paper
Times cited : (28)

References (6)
  • 3
    • 0037766952 scopus 로고    scopus 로고
    • A novel thermomechanics-based lifetime prediction model for cycle fatigue failure mechanisms in power semiconductors
    • Ciappa M, Carbognani F, Cova P, Fichtner W. A novel thermomechanics-based lifetime prediction model for cycle fatigue failure mechanisms in power semiconductors. Microelectronics Reliability, 42 (2002) 1653-1658.
    • (2002) Microelectronics Reliability , vol.42 , pp. 1653-1658
    • Ciappa, M.1    Carbognani, F.2    Cova, P.3    Fichtner, W.4
  • 6
    • 0042011164 scopus 로고    scopus 로고
    • Failure criteria for long term accelerated power cycling test linked to electrical turn off SOA on IGBT module. A 4000 hours test on 1200A-3300V Module with AlSiC base plate
    • Coquery G, Lallemand R, Failure criteria for long term accelerated power cycling test linked to electrical turn off SOA on IGBT module. A 4000 hours test on 1200A-3300V Module with AlSiC base plate. Microelectronics Reliability 40 (2000) 1665-1670.
    • (2000) Microelectronics Reliability , vol.40 , pp. 1665-1670
    • Coquery, G.1    Lallemand, R.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.