Thermal stability of thin Ti films on Al single crystal surfaces

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 21, Issue 4, 2003, Pages 1326-1331

  Ramana, C V ^a   Choi, Bum Sik ^b   Smith, R J ^a   Hutchinson, R ^a   Stuk, S P ^a   Park, Byoung Suk ^c   Saleh, Adli A ^c   Jeon, Dong Ryul ^d  

^a MONTANA STATE UNIVERSITY   (United States)

^b Jeonju University   (South Korea)

^c CHARLES EVANS AND ASSOCIATES   (United States)

^d Myong Ji University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ELECTRON SCATTERING; FILM GROWTH; INTERDIFFUSION (SOLIDS); INTERFACES (MATERIALS); IONS; IRON; SINGLE CRYSTALS; SURFACES; TEMPERATURE; THERMODYNAMIC STABILITY; THIN FILMS;

CHANNELING; LOW ENERGY ION SCATTERING; RUTHERFORD BACKSCATTERING;

TITANIUM;

EID: 0042530504     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1564039     Document Type: Article

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