Influence of gold thin-film interlayers on anodic bonding of copper microstructures produced by LIGA

Microsystem Technologies

Volumn 5, Issue 2, 1998, Pages 100-104

  Gerlach, A ^a   Maas, D ^a   Seidel, D ^a  

^a KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0042409792     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s005420050149     Document Type: Article

References (13)

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10. Maas D; Fahrenberg J; Keller W; Mihalj D; Seidel D (1994) Applicability of anodic and adhesive bonding to join microstructures consisting of various materials. Proc MICRO SYSTEM Technologies '94, Berlin, pp 481-490
11. Goschnick J; Maas D; Schuricht J; Ache HJ (1993) Depth-profiles within glass samples from anodic bonding experiments with copper using SNMS. Fresenius J Anal Chem 346: 323-326
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